SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced the ...

Heidelberg Instruments has launched its new NanoFrazor nanolithography system, advancing decades of expertise in micro- and ...

Nova says that one of the world's leading logic manufacturers recently qualified Nova Prism 2 to address backside power ...

The HybridPACK Drive G2 Fusion is the first plug'n'play power module that implements a combination of Infineon’s silicon and ...

The partnership with IPro Silicon IP Ltd. will allow Baya Systems to scale its groundbreaking technology across new global markets. IPro, a leading supplier of custom processors, security solutions, ...

Expanded network-on-chip tiling supported by mesh topology capabilities in FlexNoC and Ncore interconnect IP products allow systems-on-chip with AI to easily scale by more than 10 times without ...

With a shared vision for transparency and open-source innovation, SensiML and Efabless are addressing two of the most complex challenges in IoT development: Sourcing silicon optimized to suit the ...

Tom Fairbairn, Distinguished Engineer at Solace, explains how Absolics is using the Solace PubSub Platform to establish a ...

Dubbed the “world’s most important technology” semiconductor chips power all electrical devices from smartphones to military systems. Researchers from the University of Suss ...

Klika Tech has formed strategic partnership with Nordic Semiconductor. The Nordic Partner Program aims to drive greater adoption of wireless technology that will help customers bring their wireless ...

Jacobs has been appointed by CG Semi Private Limited, a Joint Venture between CG, Renesas Electronics Corporation, and Stars Microelectronics (Thailand) Public Co. Ltd., for engineering design of CG ...

Scholarship applications for the 2025 - 2026 academic year can be submitted immediately. The closing deadline is October 25.